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www.broadpak.com/
Broadpak.com
Most Used Html Elements
- <td> : 111
- <tr> : 84
- <img> : 62
- <a> : 52
- <br> : 42
- <span> : 33
- <li> : 19
- <table> : 15
- <strong> : 9
- <p> : 8
- <h1> : 7
- <meta> : 6
- <param> : 4
- <div> : 2
- <h2> : 2
Most Used Html Classes
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Where is www.broadpak.com hosted?
Country:
United States
City:
Burlington
Registrar:
Tucows Domains Inc.
Latitude:
42.51
Longitude:
-71.20
IP address:
66.96.149.17
IP Binary address:
1000010011000001001010100010001
IP Octal address:
10230112421
IP Hexadecimal address:
42609511
Context analysis of broadpak.com
Number of letters on this page:
4 705
Number of words on this page:
901
Number of sentences on this page:
20
Average words per sentences on this page:
45
Number of syllables on this page:
1 651
Number of Strong texts:
9
Domain name architecture
Domain name length:
12
Hyphens:
Domain doesn't contain hyphens!
Domain name with Hindi letters:
(b) र ओ अ द प अ क . च ओ म
Domain name with Hebrew letters:
בּ ר (ο) (a) ד פּ (a) ק(k) . ק(c) (ο) מ
Domain name with Cyrillic letters:
б р о a д п a к . ц о м
Domain name with Arabic letters:
ب ر (o) ا د (p) ا ك . (c) (o) م
Domain name with Greek letters:
ρ ο α δ π α κ . χ ο μ
Domain name with Chinese letters:
比 艾儿 哦 诶 迪 屁 诶 开 . 西 哦 艾马
Domain without Consonants:
brdpk.cm
Domain without Vowels:
oaa.o
Alphabet positions:
b2 r18 o15 a1 d4 p16 a1 k11 . c3 o15 m13
Domain name pattern:
V: Vowel, C: Consonant, N: Number
V: Vowel, C: Consonant, N: Number
C C V V C C V C . C V C
<HEAD> DATA INFORMATION
Encoding:
iso-8859-1
y_key:
614cafdc2ff6bc1a
verify-v1:
EGgWiYPe3Gw+xcUFrYFfdTDDl2iEIvUmQHGusFyyPpw=
Description:
3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces and provides a broad range of advanced packaging solutions from stacked chip solutions to wafer level packaging.
Keywords:
signal integrity, high speed, high speed signal integrity, TSV, through silicon via, through glass via, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, advanced packaging, package design, ball grid array, ball stack, BGA, chip scale, chip scale package, CSP, DDR II, die stack, die stacking, FBGA, fine pitch BGA, land grid array, MBGA, MCP, memory modules, memory stacking, multi chip, multi chip package, package design, package solutions, package stacking, packaging, RF module, semiconductor packaging, system in a package, SIP, stacked, stacking, system in package, system integration, system level integration, system miniaturization, broadpak, thermal management, thermal modeling, 3D wafer level packaging, WLP.
robots:
follow,index
External links in broadpak.com
- http://www.i-micronews.com/events/yole-events/eventdetail/96/-/market-briefing-enabling-advanced-packaging-technologies-for-the-connected-world.html
- http://www.semi.org/en/node/56456
- http://ieee-cicc.org/2015/
- http://www2.dac.com/events/eventdetails.aspx?id=182-252
- http://www.semi.org/eu/node/9111
- http://www.icsict.com/page.asp?id=E3A09FB7FEE5C1A45F127C0068AABFCE
- http://www.imaps.org/imaps2014/index.htm
- http://www.3dincites.com/2014/10/2014-advanced-packaging-integration-technology-symposium-spreads-message-collaborative-innovation/
- http://www2.dac.com/events/eventdetails.aspx?id=170-228
- http://ectc.net/
- http://www.date-conference.com/date14/category/session-types/tutorial
- http://www.imaps.org/devicepackaging/
- http://www.ieee-pels.org/mobile-news/2342-invitation-to-the-symposium-on-high-performance-and-emerging-technologies
- http://www.soiconsortium.org/news-events/press-releases-28.php
- http://www.asqed.com/English/Archives/2012/Tutorials.html
- http://www.date-conference.com/
- http://www.gsaglobal.org/events/2014/0320/
- http://www.dac.com/default.aspx
- https://www.i-micronews.com/events/yole-events/eventdetail/233/-/advanced-packaging-system-integration-technology-symposium.html?utm_source=communication.yole.fr&utm_medium=email&utm_campaign=PreliminaryAgendaNCAP2017
- http://www.imaps.org/programs/devicepackaging2016.htm
- http://www.i-micronews.com/component/content/article.html?id=7047:symposium-ncap-yole-2016-agenda
- http://www.semiconsea.org/advanced-packaging-forum
- http://www.iitc-conference.org/
- http://www.imec-int.com/en/home
- https://www.ibm.com/us-en/
- http://silexmicrosystems.com/
- http://www.silexmicrosystems.com/
- http://www.nanyapcb.com.tw/nypcb/english/index.aspx
- http://www.soiconsortium.org/
Internal links in broadpak.com
- index.htm
- About%20BroadPak%20Corporation%20BroadPak%20Power%20Integrity%20IR%20drop%20flip%20chip%20package%20resonance%20decoupling%20capacitor%20power%20ground%20noise%20SSO%20SSN%20Simultaneously%20Switching%20Noise.htm
- BroadPak%20Substrate%20Design%20flip%20chip%20BGA%20ASIC%20FBGA%20package%20on%20package%20system%20in%20package%20cavity%20down%203D%20wafer%20level%20packaging%20TSV%20silicon%20interposer.htm
- partners.htm
- customers.htm
- testimonials.htm
- news.htm
- Contact%20BroadPak%20Corporation%20Assembly%20package%20wirebond%20flip%20chip%20package%20stacking%20pop%20sip%20FR4%20BT%20mold%20substrate%203D%20package%20silicon%20package%20co%20design%20RF%20high%20speed.htm
- http://user2user.mentor.com/u2u-san-jose-2014-agenda/#toggle-id-2
- http://www.imaps.org/sip/index.htm#program
- mailto:inquiry@broadpak.com
Possible email addresses for broadpak.com
- info@broadpak.com
- email@broadpak.com
- support@broadpak.com
- contact@broadpak.com
- admin@broadpak.com
- postmaster@broadpak.com
- hostmaster@broadpak.com
- domain@broadpak.com
- abuse@broadpak.com
Possible Domain Typos
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